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Today, CHIPS. Tomorrow, Everything.

• Authors : COLVIN, GEOFF

Subjects: *INTEGRATED circuits; *SEMICONDUCTOR industry; *INVESTMENT tax creditSEMICONDUCTOR Industry Association (Organization) SEMICONDUCTOR Industry Association (Organization) SEMICONDUCTOR Industry Association (Organization) 021191044

• Source: Fortune. Apr/May2024, Vol. 189 Issue 2, p7-9. 3p. 1 Color Photograph.

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THE GREAT CHIP RACE.

• Authors : BLUM, ANDREW; MADDUX, BARBARA; SHAH, SIMMONE

Subjects: ECONOMIC competition; INTEGRATED circuits; SEMICONDUCTOR industry

• Source: TIME Magazine. 7/5/2021, Vol. 198 Issue 1/2, p30-39. 10p. 4 Color Photographs, 1 Diagram.

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Samsung teams up with U of I for chip talent.

• Authors : Pletz, John (AUTHOR)

Subjects: *SEMICONDUCTOR manufacturing; *INTEGRATED circuits; *SEMICONDUCTOR industryUNIVERSITY of Illinois at Urbana-Champaign ; SAMSUNG Group (Company)

• Source: Crain's Chicago Business. 9/25/2023, Vol. 46 Issue 38, p6-6. 1p.

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Applied Science & Technology Full Text (H.W. Wilson)

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GUIA: January Sales Rose 3.2% Year-Over-Year: Some 10,400 Vehicles Sold Last Month.

• Authors : RODRÍGUEZ MARTÍNEZ, EFRÉN

Subjects: *SPORT utility vehicles; *VEHICLES; *SEMICONDUCTOR industry

• Source: Caribbean Business. 2/24/2022, Vol. 8 Issue 7, p6-6. 1p.

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Virtual fabrication in modelling 14 nm horizontal double gate bilayer graphene FET NMOS/PMOS.

• Authors : Nur Hazwani Naili, M. N.; Afifah Maheran, A. H.; Salehuddin, F.

Subjects: METAL oxide semiconductor field-effect transistors; SEMICONDUCTOR materials; ELECTRONIC equipment

• Source: AIP Conference Proceedings; 2024, Vol. 2898 Issue 1, p1-9, 9p

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Advanced hybrid 2D/CMOS microchips toward the semiconductor industry.

• Authors : Hui, Fei¹ (AUTHOR) ; Tian, He^1,2 (AUTHOR)

Subjects: *SEMICONDUCTOR industry; *INTEGRATED circuits

• Source: Science Bulletin. Dec2023, Vol. 68 Issue 24, p3102-3104. 3p.

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THE GREAT CHIP DIVIDE.

• Authors : Hsu, Jeremy (AUTHOR)

Subjects: SCARCITY; MICROPROCESSORS; INTEGRATED circuits

• Source: MIT Technology Review. Jul/Aug2021, Vol. 124 Issue 4, p54-58. 4p. 1 Color Photograph.

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A Study of Advancing Ultralow-Power 3D Integrated Circuits with TEI-LP Technology and AI-Enhanced PID Autotuning.

• Authors : Jeon, Sangmin; Kwak, Hyunseok; Lee, Woojoo

Subjects: INTEGRATED circuits; TEMPERATURE inversions; TEMPERATURE effectMOORE (Okla.)

• Source: Mathematics (2227-7390); Feb2024, Vol. 12 Issue 4, p543, 19p

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INTELLECTUAL PROPERTY PROTECTION FOR INTEGRATED CIRCUITS.

• Authors : Konstantinov, Iskren

Subjects: INTELLECTUAL property; INTEGRATED circuits; SEMICONDUCTOR industry

• Source: Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika; 2024 Spl Issue, Vol. 32, p173-183, 11p

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